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? 1 ? e00738d24-ps sony reserves the right to change products and specifications without prior notice. this information does not convey any licens e by any implication or otherwise under any patents or other right. application circuits shown, if any, are typical examples illustr ating the operation of the devices. sony cannot assume responsibility for any problems arising out of the use of these circuits. cxa3328tn/en 16 pin tssop (plastic) 16 pin vson (plastic) analog signal processor rx-if ic for w-cdma cellular phones description the cxa3328tn/en is an analog signal processor rx-if ic for w-cdma cellular phones. this ic contains a gain control amplifier and quadrature demodulator. features ? wide gain control range linear gain slope wide band (100 to 600mhz) small package 16-pin tssop (cxa3328tn) 16-pin vson (cxa3328en) low voltage operation (2.7 to 3.3v) absolute maximum ratings supply voltage v cc ?0.3 to 5.5 v operating temperature topr ?55 to +125 c storage temperature tstg ?65 to +150 c operating conditions supply voltage v cc 2.7 to 3.3 v operating temperature ta ?25 to +85 c structure bipolar silicon monolithic ic block diagram 1/2 switch agc cont 1/4 15 16 14 13 12 11 10 9 2 1 3 4 5 6 7 8 vcont v cc _buf gnd_buf qx q gnd_buf ix i in inx gnd_if gnd_if v cc _if local sw local in gnd_r
? 2 ? cxa3328tn/en pin description 20k 20k vcc_if gnd_if 1 2 vcc_if 30k gnd_if 6 2k 0.5k vcc_if 50 gnd_if gnd_r 7 2k vcc_buf gnd_buf 9 10 12 13 pin no. symbol typical pin voltage [v] equivalent circuit pin description 1, 2 in, inx 2.85 if differential input. 3, 4 gnd_if 0 gca, quadrature demodulator block ground. 5 vcc_if 2.85 gca, quadrature demodulator block v cc . 6 local sw ? local frequency division ratio setting. high: 1/4 frequency division low: 1/2 frequency division 7 local in ? local input. 9, 10, 12, 13 i, ix, q, qx 1.5 baseband i, q outputs. 8 gnd_r 0 local signal gnd.
? 3 ? cxa3328tn/en vcc_if 40k 16k 12k 16k 12k gnd_if 16 16 vcont ? gain control voltage input. 11, 14 gnd_buf 0 output buffer block ground. 15 vcc_buf 2.85 output buffer block v cc . pin no. symbol typical pin voltage [v] equivalent circuit pin description
? 4 ? cxa3328tn/en input conditions (v cc = 2.85v, ta = 27 c) if input frequency 1 if input frequency 2 lo input frequency lo input level f rxif1 f rxif2 f lo v lo local sw = ? l ? local sw = ? h ? ? ? ? ? 18 380 190 760 ? 15 ? ? ? ? 12 mhz mhz mhz dbm item symbol conditions min. typ. max. unit if i/o resistance (design values) (v cc = 2.85v, ta = 27 c) if input resistance if input capacitance r iif c iif differential between pins 1 and 2 380mhz differential between pins 1 and 2 380mhz ? ? 2.6 2 ? ? k ? pf item symbol conditions min. typ. max. unit electrical characteristics current consumption (v cc = 2.85v, ta = 27 c) current consumption icc vcont = 1.3v 1 8 11 15 ma a item symbol conditions measure- ment circuit measure- ment point min. typ. max. unit i/o resistance (v cc = 2.85v, ta = 27 c) input resistance vcont pin lo input resistance output resistance i, ix, q, qx pins r ivc r ilo z out dc measurement: v in = 2.85v dc measurement: i in = 2ma dc measurement: i out = 100? 1 1 1 b c d, e f, g 10 37.5 80 ? 50 250 ? 62.5 550 k ? ? ? item symbol conditions measure- ment circuit measure- ment point min. typ. max. unit
? 5 ? cxa3328tn/en gca block (v cc = 2.85v, ta = 27 c) input conversion noise figure input conversion 3rd intercept point gain flatness minimum gain maximum gain gain temperature error nf iip3_1 iip3_2 g f g min g max g err gain = +65db gain = +65db f rxif = 382mhz f lo = 760mhz local sw = ? l ? gain = ? 10db f rxif = 382mhz f lo = 760mhz local sw = ? l ? f rxif = 382 ?2.5mhz local sw = ? l ? f lo = 2 (f rxif + 2) mhz vcont = 0.3 [v], 30mvp-p differential output f rxif = 382mhz f lo = 760mhz local sw = ? l ? vcont = 2.3 [v], 100mvp-p differential output f rxif = 382mhz f lo = 760mhz local sw = ? l ? ta = ? 25 to +85 c 3 2 2 2 2 2 2 a, b c, d a, b c, d a, b c, d a, b c, d a, b c, d a, b c, d a, b c, d ? ? 58 ? 10 ? 0.25 ? 67.5 ? 4 ? ? ? ? ? 25.5 72.5 ? 10 ? ? 0.25 ? 20.5 ? 4 db dbm dbm db db db db item symbol conditions measure- ment circuit measure- ment point min. typ. max. unit
? 6 ? cxa3328tn/en quadrature demodulator block (v cc = 2.85v, ta = 27 c) i/q maximum output amplitude i/q output band width i/q phase error i/q output amplitude balance i-ix/q-qx dc offset v max v bw p err v bl v ofst r l = 10k ? , c l = 10pf f rxif = 382mhz f lo = 760mhz local sw = ? l ? ? 3db band width f rxif = 382mhz f lo = 760mhz local sw = ? l ? f rxif = 382mhz f lo = 760mhz local sw = ? l ? dc measurement 2 2 2 2 2 a, b c, d a, b c, d a, b c, d a, b c, d a, b c, d 500 5 ? 4 ? 1.5 ? 200 ? 13 ? ? ? ? ? 4 1.5 200 mvp-p mhz deg db mv local frequency division ratio local sw (pin 6) l h frequency division ratio 1/2 1/4 item symbol conditions measure- ment circuit measure- ment point min. typ. max. unit
? 7 ? cxa3328tn/en electrical characteristics measurement circuit 1 1/2 switch agc cont 1/4 15 16 14 13 12 11 10 9 2 1 3 4 5 6 7 8 vcont v cc _buf gnd_buf qx q gnd_buf ix i in inx gnd_if 100p f rxif 82n ? 1 ? 2 600 trans 50 : 500 ? 1 gnd_if v cc _if local sw local in gnd_r b g f e d c a ? 1 lqn21a (murata mfg. co., ltd.) ? 2 616ds-1135 (toko, inc.)
? 8 ? cxa3328tn/en electrical characteristics measurement circuit 2 1/2 switch agc cont 1/4 15 16 14 13 12 11 10 9 2 1 3 4 5 6 7 8 vcont v cc _buf gnd_buf qx q gnd ix i in inx gnd_if 100p f rxif 82n ? 1 ? 2 600 trans 50 : 500 ? 1 gnd_if v cc _if local sw local in gnd_r d c b a f lo ? 1 murata lqn21a ? 2 toko 616ds-1135 10k 10p 10k 10p 10000p 10000p 10000p 10000p 10k 10p 10k 10p
? 9 ? cxa3328tn/en 1/2 switch agc cont 1/4 15 16 14 13 12 11 10 9 2 1 3 4 5 6 7 8 vcont v cc _buf gnd_buf qx q gnd ix i in inx gnd_if 100p 82n ? 1 600 1 gnd_if v cc _if local sw local in gnd_r d c b a f lo ? 1 murata lqn21a 10k 10p 10k 10p 10000p 10000p 10000p 10000p 10k 10p 10k 10p electrical characteristics measurement circuit 3
? 10 ? cxa3328tn/en 1/2 switch agc cont 1/4 15 16 14 13 12 11 10 9 2 1 3 4 5 6 7 8 vcont v cc _buf gnd_buf qx q gnd_buf ix i in inx gnd_if ? ? gnd_if vcc local signal from receive rf circuit v cc _if local sw local in gnd_r rx bpf vcc to lpf application circuit ? adjust this value so that the impedance matching with this ic is optimum. application circuits shown are typical examples illustrating the operation of the devices. sony cannot assume responsibility fo r any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same .
? 11 ? cxa3328tn/en cxa3328tn/en lpf cxa3309er lpf codec digital processing mobile station modem rf receive/transmit processing cxg1110en 1/2 1/4 phase shifter, switch if local out (i) out (q) description of operation 1. outline of operation this ic performs the signal processing between the analog transmit baseband processing block and the analog transmit rf processing block of the cellular phone. the figure below shows the general circuit block diagram for the portable cellular phone using this ic. the input of this ic is connected to the analog rf processing block; the output is connected to the baseband signal processing block. 2. ic internal signal flow an if signal and a local signal are input to this ic as shown in the figure below. the if signal is gain- controlled to the necessary level by the gain control amplifier and is input to the quadrature demodulator block. the local signal is 1/2 or 1/4 frequency-divided. also, that signal becomes the quadrature i/q local signal via the ff phase shifter and quadrature-demodulated with the if signal to become the baseband signal.
? 12 ? cxa3328tn/en notes on operation 1. if input the if signal is differentially input to the in pin and inx pin of this ic. if is input to the input pin by ac coupling. the value of the ac coupling is selected so that the transfer power from the receive rf circuit is maximum. 1 2 rx bpf ?? cxa3328tn/en from receive rf circuit 2. notes on power supplies the cxa3328tn/en is designed to operate by a 2.85v stabilized power supply to allow use with the battery driven portable phones. using multiple voltage regulators throughout the phone is recommended to minimize the power supply noise in the cxa3328tn/en power supply input. the recommended power supply range for the cxa3328tn/en is 2.7 to 3.3v. decouple the power supplies around the cxa3328tn/ en using 1? capacitor for each v cc pin. locate this capacitor as close to the pins as possible, and minimize the series inductance for the pin connections. using an additional 1nf decoupling capacitor in parallel to the 1? capacitor is recommended to further reduce the high frequency noise in the power supply input to the cxa3328tn/en. ? this value must be the value taken for the optimum impedance matching between the bpf filter and this ic.
? 13 ? cxa3328tn/en voltage gain vs. control voltage vcont 1.5 80 70 60 50 40 30 20 10 0 ? 10 ? 20 ? 30 1 0.5 0 2 2.5 3 vcont [v] voltage gain [db] noise figure vs. voltage gain 30 40 80 70 60 50 40 30 20 10 0 ? 10 10 20 ? 30 ? 20 ? 10 0 ? 40 50 60 70 80 90 voltage gain [db] noise figure [db] iip3 vs. voltage gain 30 40 10 0 ? 10 ? 20 ? 30 ? 40 ? 50 ? 60 ? 70 ? 80 10 20 ? 30 ? 20 ? 10 0 ? 40 50 60 70 80 90 voltage gain [db] iip3 [dbm] example of representative characteristics
? 14 ? cxa3328tn/en sony code eiaj code jedec code package material lead treatment lead material package mass epoxy resin solder plating copper alloy package structure 0.03g tssop-16p-l01 16pin tssop (plastic) 0.2 0.02 0.22 ? 0.03 + 0.036 0.1 0.01 0.12 ? 0.02 + 0.026 detail b x x 0.1 1 0.5 0.08 s a m 0.1 a b x4 s b 0.2 a b x2 s 0.1 16 a 2.05 4.1 9 0? to 8? 2.9 3.9 0.1 0.05 0.45 0.1 0.25 (3.0) 0.08 s s 1.2max b 8 package outline unit: mm lead plating specifications item lead material copper alloy solder composition sn-bi bi:1-4wt% plating thickness 5-18m spec. sct & kokubu ass? sony code eiaj code jedec code package material lead treatment lead material package mass epoxy resin solder plating copper alloy package structure 0.03g tssop-16p-l01 16pin tssop (plastic) 0.2 0.02 0.22 0.03 + 0.036 0.1 0.01 0.12 0.02 + 0.026 detail b x x 0.1 1 0.5 0.08 s a m 0.1 a b x4 s b 0.2 a b x2 s 0.1 16 a 2.05 4.1 9 0 ? to 8 ? 2.9 3.9 0.1 0.05 0.45 0.1 0.25 (3.0) 0.08 s s 1.2max b 8 cxa3328tn
15 cxa3328tn/en package outline unit: mm 0.05 sony code eiaj code jedec code package material lead treatment lead material package mass epoxy resin solder plating copper alloy package structure terminal section 0.2 0.01 0.23 0.02 0.03 0.03 soldrer plating 0.14 ranges of 0.1mm and 0.25mm from the end of a terminal. note: 1) the dimensions of the terminal section apply to the 16pin vson (plastic) vson-16p-01 0.02 g 0.2 s b a 3.5 2.7 2.5 0.4 b 0.2 s b a 0.05 m s a-b 2x 4x s s 0.9 max 0.6 0.5 0.2 0.13 0.025 + 0.09 0.03 1.4 0.35 0.1 0.35 0.1 0.05 sony code eiaj code jedec code package material lead treatment lead material package mass epoxy resin solder plating copper alloy package structure terminal section 0.2 0.01 0.23 0.02 0.03 0.03 soldrer plating 0.14 ranges of 0.1mm and 0.25mm from the end of a terminal. note: 1) the dimensions of the terminal section apply to the 16pin vson (plastic) vson-16p-01 0.02 g 0.2 s b a 3.5 2.7 2.5 0.4 b 0.2 s b a 0.05 m s a-b 2x 4x s s 0.9 max 0.6 0.5 0.2 0.13 0.025 + 0.09 0.03 1.4 0.35 0.1 0.35 0.1 lead plating specifications item lead material copper alloy solder composition sn-bi bi:1-4wt% plating thickness 5-18m spec. sct & kokubu ass y sony corporation cxa3328en

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